As a Die / Clip Attach Technical Expert, you will be responsible for developing and implementing competitive technical solutions across semiconductor manufacturing processes, including Pre‑Assembly, Die Bond, Wire Bond, Mold, and related areas. You will play a key role in driving equipment strategy, introducing advanced technologies, resolving complex technical challenges, and enhancing manufacturing performance in terms of cost, quality, and capability.

What You Will Do

• Equipment & Technology Strategy: Define and drive equipment strategies aligned with factory and package R&D roadmaps; evaluate and select new equipment technologies for manufacturing processes; lead equipment introduction and qualification projects.
• Process Improvement & Technical Leadership: Solve complex and chronic technical issues in manufacturing; drive improvement projects to enhance productivity, process capability, quality, and cost efficiency; develop and mai...