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Associate Equipment Engineer (Grinding/Dicing/LLO/Bonding)
Ams Osram
π
, , malaysia, Malaysia
Location
, , malaysia
Posted
June 04, 2026
Commute
Local Area
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Job Description
The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.
Responsibilities
- To implements hardware solutions for grinding/ dicing/ LLO/ Bonding process while adhering to manufacturing capabilities. Maintains, enhances, troubleshooting and supports existing tools.
- Conducts troubleshooting and repair of FE machines like dicing/ grinding/ LLO/ Bonder and other sub-tools used in FE production.
- Carry out calibration/ preventive maintenance to the machine and equipment.
- Ensure the availability of materials and spare parts. Maintains records of daily, monthly and yearly maintenance programs.
- Performs other project related to improve production operation. Assist process engineer to carry ...