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Associate Equipment Engineer (Grinding/Dicing/LLO/Bonding)

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Ams Osram
πŸ“ , , malaysia, Malaysia
πŸ“
Location , , malaysia
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Posted June 04, 2026
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Commute Local Area
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Job Description

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.

Responsibilities

  • To implements hardware solutions for grinding/ dicing/ LLO/ Bonding process while adhering to manufacturing capabilities. Maintains, enhances, troubleshooting and supports existing tools.
  • Conducts troubleshooting and repair of FE machines like dicing/ grinding/ LLO/ Bonder and other sub-tools used in FE production.
  • Carry out calibration/ preventive maintenance to the machine and equipment.
  • Ensure the availability of materials and spare parts. Maintains records of daily, monthly and yearly maintenance programs.
  • Performs other project related to improve production operation. Assist process engineer to carry ...

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πŸ“ Location Details

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City
, , malaysia
πŸ—ΊοΈ
Country
Malaysia
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Commute
Local Area

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