MISSION

We are looking for a highly skilled Assembly Process Engineer specialized in Package-on-Package (PoP) and Underfill technologies to drive advanced SMT manufacturing processes at our Hermosillo site.

In this role, you will lead the development, optimization, and scaling of complex assembly solutions for high-density electronic products, ensuring precision, reliability, and process excellence.

RESPONSIBILITIES:

PoP (Package-on-Package) Process Development

• Develop and maintain flux/paste dipping processes, optimizing transfer height and consistency.
• Fine-tune high-precision placement parameters (X, Y, θ) to ensure accurate top-package alignment.
• Analyze and mitigate component warpage during reflow to prevent HiP or open joint defects.

Underfill & Encapsulation

• Optimize dispensing parameters (needle selection, pressure, speed) for CUF or ...