Our Sedgefield based client is currently searching for an Assembly Process Engineer to cover all aspects of product assembly with a focus on high volume automated die attach and wire bonding assembly equipment. The role will involve developing and maintaining all equipment and processes within the manufacturing area, as well as providing high level technical support for yield improvement. Liaising with equipment suppliers will be an important part of the role.

Required skills for the Assembly Process Engineer will include:

Semiconductor assembly manufacturing process and equipment experience

Detailed knowledge of die attach and wire bonding processes

Process improvement knowledge

Strong communication skills

Relevant Engineering Degree (or equivalent)

Please contact Rachel Anderson for further details.