Description

: .We are facing an escalating demand for efficient information transmission, communication, and processing within the realm of electronics and microelectronics. This course is presented to meet this demand and to support electronics industry (e.g. industries located at Kanata - Canada's largest technology park) through training engineering students. The course will cover various aspects of electronic and microelectronic packaging and manufacturing. It will provide students with a deep understanding of design, processes and technologies involved in the production of modern electronic packages. The students will study topics related to levels of packaging, wafer fabrication, adhesives and bonding materials, design and production technologies of rigid and flexible electronic boards (PCB), assembly processes of electronic boards (PCBA), assembly of microelectronic and MEMS dies, connectors, wiring and routing, thermal and dynamic design in electronic syste...