About the Role

Evantis Talent Solutions is recruiting on behalf of a global leader in semiconductor assembly and advanced packaging equipment. This is an opportunity to join a highly technical team at the forefront of die bonding and advanced packaging technology, working directly with customers across the APAC region.

As an Application Engineer, you will develop and optimise die bonding processes, run customer sample evaluations in the demo room, and provide hands-on application support both remotely and on-site at customer facilities.

Key Responsibilities

• Develop die bonding processes and conduct customer sample evaluations in the demo room
• Prepare presentations and application reports for customers and internal stakeholders
• Deliver process training, application support, and optimisation o...